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Encapsulated vacuum insulation panels: theoretical thermal optimization

✍ Scribed by Tenpierik, Martin J.; Cauberg, Johannes J. M.

Book ID
121407427
Publisher
Taylor and Francis Group
Year
2010
Tongue
English
Weight
458 KB
Volume
38
Category
Article
ISSN
0961-3218

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Three thermal transport mechanisms of various filling materials for Vacuum Insulation Panels (VIPs) are theoretically investigated with special emphasis on the solid conduction. As the first, the solid conductivities of porous materials such as powder, foam, fiber and staggered beam subject to exter

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## Abstract We proposed a technique of analysis that supports the optimization of layouts for vacuum insulation panels (VIPs) for refrigerators, using a one‐dimensional technique of calculation to simulate the heat loss caused by VIP envelope materials. VIP thermal characteristics were described by