Encapsulant for nonhermetic multichip packaging applications : Albert W. Lin and Ching-Ping Wong. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(4), 510 (1992)

• Publisher: Elsevier Science
• Year: 1993
• Tongue: English
• Weight: 112 KB
• Volume: 33
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(93)90425-x