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Emerging challenges to structural integrity technology for high-temperature applications

✍ Scribed by Tu, Shantung

Book ID: 107378251
Publisher: Higher Education Press and Springer
Year: 2007
Tongue: English
Weight: 569 KB
Volume: 2
Category: Article
ISSN: 1673-3479
DOI: 10.1007/s11465-007-0066-y

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