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Embedded piezoelectric sensors to measure peel stresses in adhesive joints

โœ Scribed by G. L. Anderson; R. C. Robertson; B. L. Peterson; D. A. Dillard


Book ID
112731310
Publisher
Sage Publications
Year
1994
Tongue
English
Weight
882 KB
Volume
34
Category
Article
ISSN
0014-4851

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Techniques to reduce the peel stresses i
โœ Lucas F M da Silva; R D Adams ๐Ÿ“‚ Article ๐Ÿ“… 2007 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 1004 KB

The authors have previously developed a novel joint that consists of two adhesives, one better at low temperatures (ร€55 1C) and the other for high temperatures (200 1C). They have shown that this technique enables the design of a joint with a higher load capacity than a joint with only one adhesive,