Embedded mechatronic systems. / Volume 1, Analysis of failures, predictive reliability

✍ Scribed by El Hami, Abdelkhalak; Pougnet, Philippe

• Publisher: ISTE Press - Elsevier
• Year: 2015
• Tongue: English
• Leaves: 248
• Edition: 1
• Category: Library

✦ Synopsis

In operation, mechatronics embedded systems are stressed by loads of different causes: climate (temperature, humidity), vibration, electrical and electromagnetic. These stresses in components which induce failure mechanisms should be identified and modeled for better control. AUDACE is a collaborative project of the cluster Mov'eo that address issues specific to mechatronic reliability embedded systems. AUDACE means analyzing the causes of failure of components of mechatronic systems onboard. The goal of the project is to optimize the design of mechatronic devices by reliability.

The project brings together public sector laboratories that have expertise in analysis and modeling of failure, major groups of mechatronics (Valeo and Thales) in the automotive and aerospace and small and medium enterprises that have skills in characterization and validation tests

This book helps you to:

• Find and develop ways to characterize and validate the design robustness and reliability of complex mechatronic devices
• Develop ways to characterize physical and chemical phenomena
• Identify mechanisms of failure of components of these devices
• Analyze the physical and chemical mechanisms of failure, in order of importance
• Model failure mechanisms and design optimization

✦ Table of Contents

Content:
Front matter,Copyright,PrefaceEntitled to full text1 - Reliability-Based Design Optimization, Pages 1-25
2 - Non-Destructive Characterization by Spectroscopic Ellipsometry of Interfaces in Mechatronic Devices, Pages 27-56
3 - Method of Characterizing the Electromagnetic Environment in Hyperfrequency Circuits Encapsulated within Metallic Cavities, Pages 57-77
4 - Metrology of Static and Dynamic Displacements and Deformations Using Full-Field Techniques, Pages 79-118
5 - Characterization of Switching Transistors under Electrical Overvoltage Stresses, Pages 119-139
6 - Reliability of Radio Frequency Power Transistors to Electromagnetic and Thermal Stress, Pages 141-164
7 - Internal Temperature Measurement of Electronic Components, Pages 165-184
8 - Reliability Prediction of Embedded Electronic Systems: The FIDES Guide, Pages 185-211
9 - Study of the Dynamic Contact between Deformable Solids, Pages 213-232
List of Authors, Pages 233-234
Index, Pages 235-236
Summary of Volume 2: Analysis of Failures, Modeling, Simulation and Optimization, Pages 237, 239-245