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Elevated-Temperature Creep of Silicon Carbide-Aluminum Nitride Ceramics: Role of Grain Size

✍ Scribed by Zuei Chown Jou; Shih-Yee Kuo; Anil V. Virkar


Book ID
110823350
Publisher
John Wiley and Sons
Year
1986
Tongue
English
Weight
348 KB
Volume
69
Category
Article
ISSN
0002-7820

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