Electrospray Deposition of Photoresist: A Low Impact Method for the Fabrication of Multilayered Films

✍ Scribed by Ivo B. Rietveld; Naotoshi Suganuma; Kei Kobayashi; Hirofumi Yamada; Kazumi Matsushige

• Publisher: John Wiley and Sons
• Year: 2008
• Tongue: English
• Weight: 434 KB
• Volume: 293
• Category: Article
• ISSN: 1438-7492
• DOI: 10.1002/mame.200700419

✦ Synopsis

Abstract

Electrospray deposition has been investigated as a substitute for photoresist spin coating. The morphology of Microposit S1813 photoresist films has been studied as a function of several spray conditions including resist concentration, substrate surface, and flow rate. Film morphology is controlled by three process parameters: the surface energy determines the equilibrium conditions of resist on the substrate; the viscosity and volume flux determine the relaxation time for the depositing resist solution after impact on the substrate. Electrosprayed photoresist films have been used for photolithographic patterning and it has been demonstrated that electrospray deposition is an effective method for deposition of photoresist on top of fragile, thin films, which can be used for multilayered thin film fabrication.

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