✦ LIBER ✦

Electroresistance and thermal expansion of electron solutions based on Cu and Zn

✍ Scribed by M. E. Iskhakov; Zh. Kh. Murlieva; D. K. Palchaev

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Thermal expansion of solid solutions bas

✍ Sidorov, A. A.; Popov, P. A.; Aksenov, S. V.; Begunov, A. I.; Fedorov, P. P. 📂 Article 📅 2013 🏛 SP MAIK Nauka/Interperiodica 🌐 English ⚖ 160 KB

Microstructure and thermal expansion pro

✍ J. J. Wang; T. Omori; Y. Sutou; R. Kainuma; K. Ishida 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 827 KB

Microstructure evolution and thermal exp

✍ Yan CHEN; Lin LIU; Yue-hui WANG; Jian-hua LIU; Rui-jun ZHANG 📂 Article 📅 2011 🏛 Elsevier Science 🌐 English ⚖ 621 KB

Comments on “elastic moduli of Cu  Ni,

✍ W. Koster 📂 Article 📅 1975 🏛 Elsevier Science ⚖ 58 KB

Thermal Expansion Coefficient and Grünei

✍ R. S. Srivastava; K. Singh 📂 Article 📅 1970 🏛 John Wiley and Sons 🌐 English ⚖ 380 KB

Interaction of aqueous UO22+solutions wi

✍ M. P. Gorbacheva; S. A. Kulyukhin 📂 Article 📅 2009 🏛 Springer 🌐 English ⚖ 359 KB