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Electroplating silver tetracyanoquinodimethane between gold micro-gap electrodes for the fabrication of coplanar devices, a new way to integrate material synthesis and devices fabrication within one step

✍ Scribed by Zhuoyu Ji; Hongxiang Li; Yaling Liu; Wenping Hu


Publisher
Springer
Year
2008
Tongue
English
Weight
297 KB
Volume
91
Category
Article
ISSN
1432-0630

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