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Electronic Properties of Semiconductor Interfaces

✍ Scribed by Professor em. Dr. Winfried Mönch (auth.)

Publisher
Springer-Verlag Berlin Heidelberg
Year
2004
Tongue
English
Leaves
269
Series
Springer Series in Surface Sciences 43
Edition
1
Category
Library
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✦ Synopsis

Almost all semiconductor devices contain metal-semiconductor, insulator-semiconductor, insulator-metal and/or semiconductor-semiconductor interfaces; and their electronic properties determine the device characteristics. This is the first monograph that treats the electronic properties of all different types of semiconductor interfaces. Using the continuum of interface–induced gap states (IFIGS) as the unifying concept, Mönch explains the band-structure lineup at all types of semiconductor interfaces. These intrinsic IFIGS are the wave-function tails of electron states, which overlap a semiconductor band-gap exactly at the interface, so they originate from the quantum-mechanical tunnel effect. He shows that a more chemical view relates the IFIGS to the partial ionic character of the covalent interface-bonds and that the charge transfer across the interface may be modeled by generalizing Pauling’s electronegativity concept. The IFIGS-and-electronegativity theory is used to quantitatively explain the barrier heights and band offsets of well-characterized Schottky contacts and semiconductor heterostructures, respectively.

✦ Table of Contents

Front Matter....Pages I-XI
Introduction....Pages 1-20
Depletion Layer....Pages 21-32
Determination of Barrier Heights and offsets....Pages 33-82
Laterally Inhomogeneous Schottky Contacts....Pages 83-106
The IFIGS-and-Electronegativity Theory....Pages 107-134
The IFIGS-and-Electronegativity Concept: Experiment and Theory....Pages 135-179
First-Principles Calculations of Barrier Heights and Valence-Band Offsets....Pages 181-188
Temperature and Pressure Effects....Pages 189-201
Barrier Heights and Extrinsic Interface Defects....Pages 203-208
Extrinsic Interface Dipoles....Pages 209-226
Ohmic Contacts....Pages 227-230
Back Matter....Pages 231-264

✦ Subjects

Surfaces and Interfaces, Thin Films; Optical and Electronic Materials; Characterization and Evaluation of Materials; Engineering, general; Electronics and Microelectronics, Instrumentation

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