✦ LIBER ✦
Electronic packaging materials prepared by powder injecting molding and pressure infiltration process
✍ Scribed by YIN, F; GUO, H; JIA, C; XU, J; ZHANG, X; ZHU, X
- Book ID
- 123461848
- Publisher
- Nonferrous Metals Society of China
- Year
- 2007
- Tongue
- English
- Weight
- 472 KB
- Volume
- 26
- Category
- Article
- ISSN
- 1001-0521
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