Electron beam writes next-generation IC patterns: R. Moore, G. Caccoma, H. Pfeiffer, E. Weber and O. Woodward Electronics 138 (3 Nov 1981)
- Publisher
- Elsevier Science
- Year
- 1984
- Tongue
- English
- Weight
- 98 KB
- Volume
- 15
- Category
- Article
- ISSN
- 0026-2692
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✦ Synopsis
precious metal-based materials. These differences are primarily related to the ease of oxidation of the solder alloy powders. The relationship between solder flux chemistry and the reactivity of solder powders is described in terms of functional performance.
2. Production and Processing
Computer-aided design of VLSI circuits ARTHUR RICHARD NEWTON Proc. IEEE69 (I0), 1189 (October 1981) With the rapid evolution of integrated circuit (IC) technology to larger and more complex circuits, new approaches are needed for the design and verification of these very-large-scale integrated (VLSI) circuits. A large number of design methods are currently in use. However, the evolution of these computer aids has occurred in an ad hoc manner. In most cases, computer programs have been written to solve specific problems as they have arisen and no truly integrated computer-aided design (CAD) systems exist for the design of ICs. A structured approach both to circuit design and to circuit verification, as well as the development of integrated design systems, is necessary to produce cost-effective error-free VLSI circuits. This paper presents a review of the CAD techniques which have been used in the design of ICs, as well as a number of design methods to which the application of computer aids has proven most successful. The successful application of design-aids to VLSI circuits requires an evolution from these techniques and design methods.