✦ LIBER ✦
Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages
✍ Scribed by Seung-Hyun Chae; Xuefeng Zhang; Kuan-Hsun Lu; Huang-Lin Chao; Paul S. Ho; Min Ding; Peng Su; Trent Uehling; Lakshmi N. Ramanathan
- Book ID
- 106397505
- Publisher
- Springer US
- Year
- 2006
- Tongue
- English
- Weight
- 611 KB
- Volume
- 18
- Category
- Article
- ISSN
- 0957-4522
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