✦ LIBER ✦
Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent,n, and Implications for EM Reliability Assessment
✍ Scribed by A.S. Budiman; C.S. Hau-Riege; W.C. Baek; C. Lor; A. Huang; H.S. Kim; G. Neubauer; J. Pak; P.R. Besser; W.D. Nix
- Book ID
- 107457030
- Publisher
- Springer US
- Year
- 2010
- Tongue
- English
- Weight
- 396 KB
- Volume
- 39
- Category
- Article
- ISSN
- 0361-5235
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