Electromigration in Thin Films and Electronic Devices: Materials and Reliability

✍ Scribed by Choong-Un Kim

Publisher: Woodhead Publishing
Year: 2011
Tongue: English
Leaves: 345
Category: Library

No coin nor oath required. For personal study only.

✦ Synopsis

Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area. Part one consists of three introductory chapters, covering modeling of electromigration phenomena, modeling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.

✦ Subjects

Приборостроение;Полупроводниковые приборы;

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