✦ LIBER ✦
Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy
✍ Scribed by H.X. Xie, D. Friedman, K. Mirpuri, N. Chawla
- Book ID
- 120925705
- Publisher
- Springer US
- Year
- 2013
- Tongue
- English
- Weight
- 1022 KB
- Volume
- 43
- Category
- Article
- ISSN
- 0361-5235
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