✦ LIBER ✦
Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints
✍ Scribed by Fu Guo; Guangchen Xu; Hongwen He
- Book ID
- 106395132
- Publisher
- Springer
- Year
- 2009
- Tongue
- English
- Weight
- 497 KB
- Volume
- 44
- Category
- Article
- ISSN
- 0022-2461
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