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Electroless Copper/Nickel Films Deposited on AlN Substrates

✍ Scribed by Liang, Muh-Wang; Hsieh, Tsung-Eong; Chen, Chi-Chin; Hung, Yuan-Te

Book ID: 126210859
Publisher: Institute of Pure and Applied Physics
Year: 2004
Tongue: English
Weight: 662 KB
Volume: 43
Category: Article
ISSN: 0021-4922
DOI: 10.1143/JJAP.43.8258

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