Electroless copper deposition by non-isothermal deposition technology

✍ Scribed by Y. Sung; Y.H. Chou; W.H. Hwu; Y.C. Fan; J.L. Cheng; M.D. Ger

• Book ID: 113782819
• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 768 KB
• Volume: 113
• Category: Article
• ISSN: 0254-0584
• DOI: 10.1016/j.matchemphys.2008.07.075