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Electroformed thin gold films on regularly corrugated substrates

✍ Scribed by M.I. Newton; G. McHale; D. Smith


Publisher
Elsevier Science
Year
1993
Tongue
English
Weight
303 KB
Volume
44
Category
Article
ISSN
0042-207X

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## Abstract Metallic thin‐film plasticity has been widely studied by using the difference between the coefficients of thermal expansion of the film and the underlying substrate to induce stress. This approach is commonly known as the wafer curvature technique, based on the Stoney equation, which ha