✦ LIBER ✦
Electrochemical deposition of Copper on patterned Cu/Ta(N)/SiO2surfaces for super filling of sub-micron features
✍ Scribed by W.H. Li; J.H. Ye; S.F.Y. Li
- Book ID
- 110325054
- Publisher
- Springer
- Year
- 2001
- Tongue
- English
- Weight
- 241 KB
- Volume
- 31
- Category
- Article
- ISSN
- 0021-891X
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