Electrical modeling of packaging discontinuities: A general methodology based on the three-dimensional TLM concept

✍ Scribed by Boussetta, Chokri ;Ndagijimana, Fabien ;Chilo, Jean ;Saguet, Pierre

• Publisher: John Wiley and Sons
• Year: 1995
• Tongue: English
• Weight: 887 KB
• Volume: 5
• Category: Article
• ISSN: 1050-1827
• DOI: 10.1002/mmce.4570050207

✦ Synopsis

Abstract

A general methodology for modeling packages using the three‐dimensional (3D) TLM method is presented. S parameters are calculated from reflected and transmitted signals, and electrical parameters of equivalent networks are extracted. Frequency domain results (up to 30 GHz) are presented for a microstrip right‐angle bend, a cross junction, and vias. The purpose of this article is to demonstrate the possibilities of using the 3D TLM method for electrical modeling in packaging applications.