Electrical interconnection in anodic bonding of silicon wafer to LTCC wafer using highly compliant porous bumps made from submicron gold particles

✍ Scribed by Shuji Tanaka; Mamoru Mohri; Toshinori Ogashiwa; Hideyuki Fukushi; Katsunao Tanaka; Daisuke Nakamura; Takashi Nishimori; Masayoshi Esashi

• Book ID: 119368206
• Publisher: Elsevier Science
• Year: 2012
• Tongue: English
• Weight: 766 KB
• Volume: 188
• Category: Article
• ISSN: 0924-4247
• DOI: 10.1016/j.sna.2012.01.003