✦ LIBER ✦

Electrical and structural analysis of conductive polyaniline/polyimide blends

✍ Scribed by Moon Gyu Han; Seung Soon Im

Publisher: John Wiley and Sons
Year: 1999
Tongue: English
Weight: 326 KB
Volume: 71
Category: Article
ISSN: 0021-8995
DOI: 10.1002/(sici)1097-4628(19990328)71:13<2169::aid-app7>3.0.co;2-p

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✦ Synopsis

Conducting films of dodecylbenzenesulfonic (DBSA)-doped polyaniline/ polyimide (PANI/PI) blends with various compositions were prepared by solvent casting followed by a thermal imidization process. Electrical and physical properties of the blends were characterized by infrared spectroscopy, an X-ray diffraction technique, thermal analysis, a UV-vis spectrophotometer, a dielectrometer, and conductivity measurements. The blends exhibited a relatively low percolation threshold of electrical conductivity at 5 wt % PANI content and showed higher conductivity than that of pure DBSA-doped PANI when the PANI content exceeded 20 wt %. A lower percolation threshold and a lower compatibility was shown between the two components in the blends than those of PANI-camphorsulfonic acid/polyamic acid (PANI-CSA/PAA). A well-defined layered structure due to the alignment of the long alkyl chain dopant perpendicular to the PANI main chain was evidenced by WAXD spectra.

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