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Efficient sensitivity analysis and optimization of shell structures by the ABAQUS code

โœ Scribed by W. H. Zhang; M. Domaszewski

Publisher
Springer-Verlag
Year
1999
Tongue
English
Weight
900 KB
Volume
18
Category
Article
ISSN
1615-1488

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For integrated circuit (IC) wafer back-end development, state-of-the-art CMOS-technologies have to be developed and robust bond pad structures have to be designed in order to guarantee both functionality and reliability during waferfab processes, packaging, qualification tests, and, of course, usage