Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability

✍ Scribed by Hitoshi Sakurai; Alongheng Baated; Kiju Lee; Seongjun Kim; Keun-Soo Kim; Youichi Kukimoto; Seishi Kumamoto; Katsuaki Suganuma

• Book ID: 107457024
• Publisher: Springer US
• Year: 2010
• Tongue: English
• Weight: 493 KB
• Volume: 39
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-010-1344-8