๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Effects of temperature and strain rate on the mechanical properties of lead-free solders

โœ Scribed by Hongtao Ma


Publisher
Springer
Year
2010
Tongue
English
Weight
582 KB
Volume
45
Category
Article
ISSN
0022-2461

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


Comparison of isothermal mechanical fati
โœ C. Andersson; Z. Lai; J. Liu; H. Jiang; Y. Yu ๐Ÿ“‚ Article ๐Ÿ“… 2005 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 424 KB

Low-cycle isothermal mechanical fatigue testing of bulk solders and solder joints of eutectic Sn-37 wt% Pb, Sn-3.5 wt% Ag and Sn-4.0 wt% Ag-0.5 wt% Cu were carried out at room temperature over a wide range of strains (1-10%). The fatigue results of both bulk and solder joints were compared; the eute

Effect of cooling rate on the room-tempe
โœ Mahmudi, R. ;Geranmayeh, A. R. ;Mahmoodi, S. R. ;Khalatbari, A. ๐Ÿ“‚ Article ๐Ÿ“… 2007 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 418 KB

## Abstract The influence of cooling rate on the creep behavior of cast Snโ€“(1โ€“5)%Bi solder alloys was studied by indentation testing at room temperature. The alloys were prepared at two different cooling rates of 0.01 Ks^โ€“1^ and 8 Ks^โ€“1^. This affected the microstructure and thus, the creep behavio