Effects of temperature and strain rate on the mechanical properties of lead-free solders
โ Scribed by Hongtao Ma
- Publisher
- Springer
- Year
- 2010
- Tongue
- English
- Weight
- 582 KB
- Volume
- 45
- Category
- Article
- ISSN
- 0022-2461
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Low-cycle isothermal mechanical fatigue testing of bulk solders and solder joints of eutectic Sn-37 wt% Pb, Sn-3.5 wt% Ag and Sn-4.0 wt% Ag-0.5 wt% Cu were carried out at room temperature over a wide range of strains (1-10%). The fatigue results of both bulk and solder joints were compared; the eute
## Abstract The influence of cooling rate on the creep behavior of cast Snโ(1โ5)%Bi solder alloys was studied by indentation testing at room temperature. The alloys were prepared at two different cooling rates of 0.01 Ks^โ1^ and 8 Ks^โ1^. This affected the microstructure and thus, the creep behavio