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Effects of residual stress on fracture strength of Si3N4/stainless steel joints with a Cu-interlayer

✍ Scribed by Hwisouck Chang; Sung-Churl Choi; Sang-Whan Park; Tae-Woo Kim

Book ID
111786114
Publisher
Springer US
Year
2002
Tongue
English
Weight
246 KB
Volume
11
Category
Article
ISSN
1059-9495

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A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si 3 N 4 joints were obtained. The effect of Ti content on the microstructure and properties of the Si 3 N 4 joints was investigated using EPMA, SEM and three-point bendin