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Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder

✍ Scribed by SHEN, J; LIU, Y; HAN, Y; GAO, H

Book ID
122513179
Publisher
Nonferrous Metals Society of China
Year
2006
Tongue
English
Weight
842 KB
Volume
25
Category
Article
ISSN
1001-0521

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