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Effects of plasma treatment in the tungsten process for chemical vapor deposition titanium nitride barrier film beyond nanometer technology

✍ Scribed by K.W. Chen; Y.L. Wang; L. Chang; F.Y. Li; G.J. Hwang


Book ID
108288922
Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
938 KB
Volume
498
Category
Article
ISSN
0040-6090

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