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Effects of Ni cladding layers on suppression of Ag agglomeration in Ag-based Ohmic contacts on p-GaN

โœ Scribed by Son, Jun Ho; Song, Yang Hee; Yu, Hak Ki; Lee, Jong-Lam


Book ID
120360315
Publisher
American Institute of Physics
Year
2009
Tongue
English
Weight
720 KB
Volume
95
Category
Article
ISSN
0003-6951

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