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Effects of high uniform magnetic fields on diffusion behavior at the Cu/Al solid/liquid interface

✍ Scribed by Qiang Wang; Dong-gang Li; Kai Wang; Zhong-ying Wang; Ji-cheng He


Book ID
113896525
Publisher
Elsevier Science
Year
2007
Tongue
English
Weight
289 KB
Volume
56
Category
Article
ISSN
1359-6462

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The creep behavior of Al-Cu alloys containing 2 and 4 wt.% Cu was investigated at a temperature of 813 K and over a stress range of 0.5-10 MPa. The present results, along with previous data on Al-Cu alloy, suggest the presence of three regions of deformations: region I at low stresses, region II at