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Effects of grain boundary diffusion of copper on nickel creep

✍ Scribed by G. P. Grabovetskaya; I. V. Ratochka; E. V. Kabanova; E. V. Naidenkin; I. K. Zverev; Yu. R. Kolobov; R. Z. Valiev

No coin nor oath required. For personal study only.

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