The fracture toughness of an epoxy-based film adhesive has been investigated using Mode I and combined Mode 1 + Mode II loadings. The opening Mode, Mode I, was realized by employing the Tapered Double Cantilever Beam (TDCB) specimen, while the mixed opening and shear modes, Mode I + Mode II, resulte
Effects of environmental exposure on adhesively bonded joints
โ Scribed by H.M. Hand; C.O. Arah; D.K. McNamara; M.F. Mecklenburg
- Publisher
- Elsevier Science
- Year
- 1992
- Tongue
- English
- Weight
- 630 KB
- Volume
- 6
- Category
- Article
- ISSN
- 0950-0618
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