✦ LIBER ✦
Effects of different printed-circuit-board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued, small outline J leads/Sn-Ag-Cu interfaces
✍ Scribed by Pei-Lin Wu; Meng-Kuang Huang; Chiapyng Lee; Shyh-Rong Tzan
- Publisher
- Springer US
- Year
- 2004
- Tongue
- English
- Weight
- 307 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0361-5235
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