✦ LIBER ✦
Effects of Cu Interdiffusion on the Electromigration Failure of FM/Cu/FM Tri-Layers for Spin Valve Read Sensors
✍ Scribed by Jing Jiang; Seongtae Bae; Sunwook Kim
- Book ID
- 111874389
- Publisher
- IEEE
- Year
- 2007
- Tongue
- English
- Weight
- 430 KB
- Volume
- 43
- Category
- Article
- ISSN
- 0018-9464
No coin nor oath required. For personal study only.