✦ LIBER ✦
Effects of alumina substrate defects on thin-film interconnect patterns : R. C. Sundahl and E. J. Sedora. Proc. IEEE. 59, No. 10 (1971), p. 1462
- Publisher
- Elsevier Science
- Year
- 1972
- Tongue
- English
- Weight
- 110 KB
- Volume
- 11
- Category
- Article
- ISSN
- 0026-2714
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