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Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects

✍ Scribed by Cher Ming Tan; Arijit Roy; Kok Tong Tan; Derek Sim Kwang Ye; Frankie Low

Book ID
108210579
Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
756 KB
Volume
45
Category
Article
ISSN
0026-2714

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## Abstract The effect of heat treatment on the gas barrier of the polymer‐coated board further coated with an Al~2~O~3~ layer by atomic layer deposition (ALD) was studied. Heat treatment below the melting point of the polymer followed by quenching at room temperature was used for the polylactide‐c