Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application

✍ Scribed by K. L. Chan; M. Mariatti; Z. Lockman; L. C. Sim

• Publisher: Springer US
• Year: 2009
• Tongue: English
• Weight: 667 KB
• Volume: 21
• Category: Article
• ISSN: 0957-4522
• DOI: 10.1007/s10854-009-9991-3