Effect of joining temperature on the mic
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Zhihong Zhong; Hun-chea Jung; Tatsuya Hinoki; Akira Kohyama
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Article
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2010
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Elsevier Science
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English
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A diffusion bonding process, for joining of tungsten to ferritic steel using nickel as an interlayer, was developed for nuclear component application. The effect of joining temperature on the microstructure and tensile strength of the joint was investigated in this work. Metallographic analysis reve