Effect of TiO2nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish

✍ Scribed by L. C. Tsao; M. W. Wu; S. Y. Chang

• Publisher: Springer US
• Year: 2011
• Tongue: English
• Weight: 701 KB
• Volume: 23
• Category: Article
• ISSN: 0957-4522
• DOI: 10.1007/s10854-011-0471-1