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Effect of thermomechanical treatments on microstructure and properties of Cu-base leadframe alloy

✍ Scribed by Ho J. Ryu; Hyung K. Baik; Soon H. Hong

Book ID: 111537366
Publisher: Springer
Year: 2000
Tongue: English
Weight: 483 KB
Volume: 35
Category: Article
ISSN: 0022-2461
DOI: 10.1023/a:1004830000742

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