𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Effect of thermal history on creep behaviour of a Cu-16Al solid solution alloy

✍ Scribed by M. Pahutová; V. Šustek; J. Čadek

Book ID
116165125
Publisher
Elsevier Science
Year
1995
Weight
535 KB
Volume
33
Category
Article
ISSN
0956-716X

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Effect of Cu concentration on the high-t
Effect of Cu concentration on the high-temperature creep behavior of AlCu solid solution alloys
✍ M.S. Soliman 📂 Article 📅 1995 🏛 Elsevier Science 🌐 English ⚖ 703 KB

The creep behavior of Al-Cu alloys containing 2 and 4 wt.% Cu was investigated at a temperature of 813 K and over a stress range of 0.5-10 MPa. The present results, along with previous data on Al-Cu alloy, suggest the presence of three regions of deformations: region I at low stresses, region II at

The influence of stacking fault energy o
The influence of stacking fault energy on the creep behaviour of Ni-Cu-solid-solution alloys at intermediate temperatures
✍ M. S. Soliman 📂 Article 📅 1995 🏛 Springer 🌐 English ⚖ 434 KB

The creep characteristics of Ni-Cu alloys at intermediate temperatures (T 7) and the activation energy for creep (which is less than the activation energy for lattice diffusion), suggest that the creep mechanism is dislocation climb controlled by pipe diffusion. The present analysis shows that the c