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Effect of thermal expansion anisotropy on crack deflections in brittle materials

โœ Scribed by J. C. Lee


Publisher
Springer Netherlands
Year
1990
Tongue
English
Weight
707 KB
Volume
46
Category
Article
ISSN
1573-2673

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โœฆ Synopsis


A hexagonal grain array model is used to study the deflection of grain boundary microcracks in a polycrystalline aggregate due to external load and residual stress of thermal anisotropy. Each grain is assumed to be elastically isotropic but thermally anisotropic. An explicit analytical solution is obtained for the entire residual stress field. The kink is simulated as a continuous distribution of dislocations. The final equations are solved numerically with dislocation densities as unknown quantities. It is seen that the solution is sensitive to the distribution of thermal expansion orientation.


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