Effect of thermal expansion anisotropy on crack deflections in brittle materials
โ Scribed by J. C. Lee
- Publisher
- Springer Netherlands
- Year
- 1990
- Tongue
- English
- Weight
- 707 KB
- Volume
- 46
- Category
- Article
- ISSN
- 1573-2673
No coin nor oath required. For personal study only.
โฆ Synopsis
A hexagonal grain array model is used to study the deflection of grain boundary microcracks in a polycrystalline aggregate due to external load and residual stress of thermal anisotropy. Each grain is assumed to be elastically isotropic but thermally anisotropic. An explicit analytical solution is obtained for the entire residual stress field. The kink is simulated as a continuous distribution of dislocations. The final equations are solved numerically with dislocation densities as unknown quantities. It is seen that the solution is sensitive to the distribution of thermal expansion orientation.
๐ SIMILAR VOLUMES
Luzzati's method for the evaluation of multiple X-ray small angle scattering has been revised and completed. Under the usual experimental conditions multiple scattering occurs practically in all cases in which the produce of the average pore size (in A) and the volume fraction of pores is larger tha
Microstructural observations of brittle materials indicated that a variety of microdefect events can be responsible not only for inelastic behaviour, but also for macroscopic crack front irregularity. This irregularity produces an increase in the fracture toughness of the material. In this paper, th