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Effect of thermal and stress exposure on grain boundaries of silicon nitride

✍ Scribed by S.A. Bradley; K.R. Karasek

Publisher: Elsevier Science
Year: 1989
Tongue: English
Weight: 944 KB
Volume: 29
Category: Article
ISSN: 0304-3991
DOI: 10.1016/0304-3991(89)90226-x

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