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Effect of temperature-pressure cycles on structural properties of epoxy-based composites for printed circuit boards applications

✍ Scribed by Elizabeth G. Fernandes; Cristiano Tramidi; Giordano M. Di Gregorio; Giacomo Angeloni; Emo Chiellini


Publisher
John Wiley and Sons
Year
2008
Tongue
English
Weight
228 KB
Volume
110
Category
Article
ISSN
0021-8995

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