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Effect of swelling pretreatment on the deposition structure on electroless copper of polyacrylonitrile nanocomposites for electromagnetic interference shielding

โœ Scribed by Chang-Cheng Chen; Chih-Wei Hung; Sung-Yeng Yang; Chi-Yuan Huang


Publisher
John Wiley and Sons
Year
2008
Tongue
English
Weight
572 KB
Volume
109
Category
Article
ISSN
0021-8995

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๐Ÿ“œ SIMILAR VOLUMES


Effect of weak reductant on properties o
โœ Keng-Yu Tsao; Chang-Cheng Chen; Chi-Yuan Huang; Ching-Shan Tsai; Sung-Yeng Yang; ๐Ÿ“‚ Article ๐Ÿ“… 2010 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 551 KB

In this work, the electroless copper method with different reductant compositions (NaHSO 3 /Na 2 S 2 O 3 ร5H 2 O and Na 2 S 2 O 3 ร5H 2 O) without sensitizing and activating, was used to deposit copper-sulfide deposition on the polyacrylonitrile (PAN) surface for electromagnetic interference (EMI) s