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Effect of Substrate Temperature on Deposition Behavior of Copper Particles on Substrate Surfaces in the Cold Spray Process

✍ Scribed by M. Fukumoto; H. Wada; K. Tanabe; M. Yamada; E. Yamaguchi; A. Niwa; M. Sugimoto; M. Izawa

No coin nor oath required. For personal study only.

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