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Effect of solution treatment temperature on solute re-distribution at the grain boundaries in AlLiCuMg alloy

✍ Scribed by R.D.K. Misra; T.V. Balasubramanian

Book ID
116061994
Publisher
Elsevier Science
Year
1985
Weight
355 KB
Volume
19
Category
Article
ISSN
0036-9748

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The creep behavior of Al-Cu alloys containing 2 and 4 wt.% Cu was investigated at a temperature of 813 K and over a stress range of 0.5-10 MPa. The present results, along with previous data on Al-Cu alloy, suggest the presence of three regions of deformations: region I at low stresses, region II at