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Effect of solution flow rate and direction on copper electrodeposition process from sulfuric acid electrolyte on porous electrode with high electric conductivity

✍ Scribed by A. Zh. Medvedev; A. F. Zherebilov; A. I. Masliiy; N. P. Poddubnyi


Book ID
110201787
Publisher
SP MAIK Nauka/Interperiodica
Year
2008
Tongue
English
Weight
306 KB
Volume
44
Category
Article
ISSN
1023-1935

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